Micro-type fully flip-chip common cathode COB display panel
Main features:
Revolutionary Flip-Chip COB Technology
Engineered with state‑of‑the‑art flip‑chip COB (Chip‑on‑Board)
technology and common‑cathode energy‑saving Micro LED chips, our
display delivers an extraordinary 100W:1 ultra‑high contrast ratio
– far surpassing conventional LED screens – while achieving
exceptional ink‑color consistency across the entire panel. The
result is stunning, lifelike imagery with pure blacks and brilliant
highlights that captivate every viewer.
Sleek, Ultra‑Thin Profile
At just 28mm overall thickness, this display rivals the slimness of
LCD TVs, setting a new industry benchmark for large‑format LED
screens. Its minimalist design seamlessly integrates into any
high‑end environment, from luxury homes to corporate boardrooms.
Intelligent Energy Efficiency
The common‑cathode architecture delivers the same brightness as
traditional LEDs while consuming 50% less power and generating
significantly less heat. The panel remains cool to the touch,
enhancing both energy savings and long‑term reliability.
Built to Last – IP65 Protection
Engineered for demanding installations, the display boasts
IP65‑rated dustproof, waterproof, and impact‑resistant
construction, ensuring stable 24/7 operation in virtually any
environment. Full ROHS certification underscores our commitment to
environmental responsibility and user safety.
Seamless, Boundless Creativity
With gapless splicing and virtually invisible seams, the display
enables infinite, seamless large‑format configurations that deliver
an immersive, uninterrupted visual experience – perfect for command
centers, exhibition halls, and immersive installations.
Effortless Maintenance
Fully front‑serviceable design with hot‑swappable modules allows
for quick, tool‑free maintenance without accessing the rear,
minimizing downtime and simplifying long‑term ownership.
Product Advantages:
• Seamless splicing – no visible gaps, creating a truly unified
display surface.
• Excellent heat dissipation – efficient thermal management for
stable performance.
• Superior flatness – ensures consistent image quality across the
entire screen.
• Low temperature rise – keeps the panel cool even during extended
operation.
• Long lifespan – built with durable components for years of
reliable service.
• Fanless design – eliminates moving parts, reducing maintenance
needs.
• Silent operation – zero noise, perfect for quiet environments
like home theaters and conference rooms.
• Automatic alarm system – real‑time monitoring with instant fault
alerts.
• Low failure rate – high reliability with minimal downtime.
• Safe and secure – designed with multiple protections for
worry‑free use
Product Specifications
| Parameter | P0.78125 | P0.9375 | P1.25 | P1.5625 |
|---|
| Pixel Pitch (mm) | 0.78125 | 0.9375 | 1.25 | 1.5625 |
| Pixel Density (px/m²) | 1,638,400 | 1,137,778 | 640,000 | 409,600 |
| Cabinet Resolution (px) | 768 × 432 | 640 × 360 | 480 × 270 | 384 × 216 |
| Refresh Rate (Hz) | ≤ 3840 | | | |
| Cabinet Size (mm) | 600 × 337.5 × 28 | | | |
| LED Type | Flip‑chip Common‑Cathode COB Package | | | |
| White Balance Brightness (CD/m²) | 200 ~ 1000 (adjustable) | | | |
| Contrast Ratio | ≥ 1,000,000 : 1 | | | |
| Gray Scale (Bit) | 13 ~ 16 | | | |
Strict Aging Test Procedure
Before shipment, every display unit undergoes a rigorous aging test
(burn‑in test) . During this process, the screen operates
continuously under full‑load conditions for an extended period,
simulating real‑world usage scenarios. This critical step ensures
long‑term stability, identifies any potential component issues
early, and guarantees that your display delivers reliable,
flicker‑free performance from day one.
Pre‑Shipment Precision Calibration
Prior to packaging, our experienced engineers perform a
comprehensive pre‑shipment calibration on each cabinet. Using
advanced optical instruments, we fine‑tune brightness, color
uniformity, and grayscale accuracy pixel by pixel. This meticulous
process ensures that every unit achieves optimal visual
consistency, so your screen arrives ready to deliver stunning,
perfectly matched imagery – right out of the box.
Your Assurance of Quality
With our aging and calibration protocols, you can be confident that
your display will perform flawlessly upon installation, providing
the exceptional visual experience you expect.
FAQ: What are the differences between COB, GOB and SMD LED modules?
Comparison Table
| Aspect | SMD (Surface‑Mounted Device) | GOB (Glue‑on‑Board) | COB (Chip‑on‑Board) |
|---|
| Technology Principle | Individual LED chips are soldered onto the PCB surface via SMT
process. | Based on SMD, a transparent protective adhesive layer is
vacuum‑molded over the PCB and LED chips. | LED chips are directly bonded (die‑attached) onto the PCB substrate
and encapsulated as a whole, eliminating the individual package
step. |
| Light Source Type | Point light source | Point light source (optimized by the protective layer) | Surface light source |
| Pixel Density | Low to medium; difficult to achieve below P1.0 | Limited by SMD structure; hard to realize ultra‑fine pitch | Extremely high; supports pixel pitches below P0.5 |
| Protection Performance | Weak; exposed chips are vulnerable to moisture and physical impact | Strong – provides waterproof, dustproof, anti‑static,
anti‑collision and other “ten‑fold” protective features | Strongest – integrated encapsulation offers excellent resistance to
impact, moisture, dust and static electricity |
| Display Quality | Visible pixel grain at close viewing distances; physical gaps
between chips | Good uniformity; 160° wide viewing angle; effectively reduces moiré
patterns | Best – seamless splicing, fine image without graininess, near‑180°
viewing angle, precise color rendition |
| Heat Dissipation | Average | Relatively poor (the adhesive layer may hinder heat dissipation) | Excellent – chips directly contact the PCB, low thermal resistance
and fast heat conduction |
| Maintenance | Easy – individual LEDs can be replaced on‑site | Moderately easy – protective layer reduces damage rate; field
repair possible | Difficult – a faulty module usually requires full replacement; high
repair cost |
| Cost | Low (mature technology) | Medium (between SMD and COB) | High (complex process and high equipment investment) |
| Typical Applications | Outdoor advertising, stage backdrops, stadiums, and other
medium‑to‑large pitch scenarios | Public transport, education, retail, and other environments
requiring enhanced protection | High‑end conference rooms, command & control centers, home
theaters, showrooms – any ultra‑fine‑pitch, premium setting |
Summary: Which one should you choose?
| If you need... | Recommended |
|---|
| Ultimate image quality + ultra‑fine pitch, and budget is not a
primary concern | COB |
| High protection with a good balance of performance and cost | GOB |
| Cost‑effectiveness, larger pitch, and easy on‑site maintenance | SMD |
